拥有1-40层、高精密、特殊工艺PCB制造能力
采用先进的生产设备,实现高品质生产工艺,比如裸铜、沉金、沉银、无铅喷锡、OSP、埋孔、阻抗控制等特殊工艺我们都能做到
项目 | 2021 | 2022 | |||
多层板 | 层数 | MAX | 样品:40L | 样品:42L | |
MAX | 批量:24L | 批量:30L | |||
板厚 | MIN | 样品:0.3mm | 样品:0.3mm | ||
批量:0.4mm | 批量:0.4mm | ||||
MAX | 样品:5.0mm | 样品:6.4mm | |||
批量:3.2mm | 批量:5.0mm | ||||
基铜 | 内层 | MIN | 0.5 OZ | 0.5 OZ | |
MAX | 6 OZ | 6 OZ | |||
外层 | MIN | 1/3 OZ | 1/3 OZ | ||
MAX | 6 OZ | 6 OZ | |||
钻孔孔径 | MIN | 样品:0.1mm | |||
批量:0.15mm | 批量:0.1mm | ||||
钻孔公差 | MIN | PTH:±0.05mm | PTH:±0.05 | ||
NPTH:±0.025mm | NPTH:±0.025mm | ||||
孔径纵横比 | MAX | 样品:20:1 | 样品:22:1 | ||
批量:16:1 | 批量:10:1 | ||||
锣板公差 | MIN | 样品:±0.05mm | 样品:±0.05mm | ||
批量:±0.10mm | 批量:±0.075mm | ||||
线宽/线距 | 内层 | MIN | 0.06/0.06mm | 0.05/0.05mm | |
外层 | MIN | 0.075/0.075mm | 0.075/0.075mm | ||
阻抗公差 | MIN | 样品:±8% | |||
批量:±10% | 批量:±8% | ||||
出货尺寸 | MIN | 样品:880*880mm | 样品:880*1200mm | ||
MAX | 批量:800*800mm | 批量:800*800mm | |||
BGA焊盘 | MIN | 0.2mm | 0.15mm | ||
BGA节距 | MIN | 0.65mm | 0.5mm | ||
板翘曲度 | MIN | 0.005 | 0.005 | ||
特殊工艺 | 长短金手指,分级金手指,阶梯金手指,控深钻,背钻,填孔电镀 | ||||
HDI | 层数 | MAX | 16L | 18L | |
板厚 | MIN | 0.3mm | 0.3mm | ||
钻孔孔径 | 盲孔 | MIN | 0.075mm | 0.05mm | |
埋孔 | MIN | 0.10mm | 0.10mm | ||
通孔 | MIN | 0.10mm | 0.10mm | ||
钻孔公差 | MIN | PTH:±0.05mm | PTH:±0.05 | ||
NPTH:±0.025mm | NPTH:±0.025mm | ||||
盲孔填孔纵横比 | MAX | ≤0.8:1 | ≤1:1 | ||
锣板公差 | MIN | 样品:±0.05mm | 样品:±0.05mm | ||
批量:±0.10mm | 批量:±0.075mm | ||||
线宽/线距 | MIN | 0.05/0.05mm | 0.04/0.04mm | ||
镭射盲孔填孔凹陷 | MIN | 15/15um | 15/10um | ||
阻抗公差 | MIN | ±10% | ±8% | ||
BGA焊盘 | MIN | 0.15mm | 0.15mm | ||
BGA节距 | MIN | 0.35mm | 0.3mm | ||
板翘曲度 | MIN | 0.005 | 0.005 |